DARPA Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC)

Sponsor Deadline: 

Mar 12, 2019

Letter of Intent Deadline: 

Jan 25, 2019

Sponsor: 

DOD Defense Advanced Research Projects Agency

UI Contact: 

DARPA Technologies for Mixed-mode Ultra Scaled Integrated Circuits (T-MUSIC) 
HR001119S0016
grants.gov  https://www.grants.gov/web/grants/view-opportunity.html?oppId=311773
FedBizOpps  https://www.fbo.gov/index?s=opportunity&mode=form&id=77de1b64d33a99d22da...
Abstract (strongly encouraged) due  January 25, 2019 – 1:00 PM EST

The DARPA Microsystems Technology Office is soliciting research proposals for the development of advanced RF mixed-mode foundry processes, building blocks, and novel high frequency mixed-mode devices on a CMOS fabrication platform. It is expected that such advances will enable new DoD applications including high capacity, robust communications, radars, and precision sensors.

The Microsystems Technology Office at DARPA seeks innovative proposals to develop
integrated, ultra-broadband, mixed-mode electronics with embedded advanced digital CMOS
(Complementary Metal-Oxide-Semiconductor) electronics in a U.S. domestic foundry fabrication
platform. This advanced analog radio frequency (RF) mixed-mode electronics platform would
provide ultra-wide instantaneous bandwidth, higher spur-free dynamic range (SFDR), and finer
data converter resolution with more effective number of bits (ENOB) than the current state of the
art. The incorporation of embedded digital CMOS electronics, with an end goal of an advanced 22
nm or smaller processes, will result in highly integrated digital processing and intelligence on one
chip to provide differentiating capabilities for DoD systems. T-MUSIC will provide the foundation
for enduring U.S. leadership in mixed-mode electronics technology by further developing nextgeneration
THz (terahertz) mixed-mode devices designed for integration with an advanced CMOS
fabrication platform. This is expected to greatly enhance Department of Defense (DoD)
capabilities in advanced RF sensors and high capacity communications.

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